Electronics Product

​Review

Electronic Chip

Uni Precision offers a specialized expertise in vertical electronic manufacturing services. Our engineers can advise on PCBA, cabling, design and final box build, and will help to produce electronic components that exceed expectations for performance and value.

From customized electronic prototypes to turnkey manufacturing services, many large companies rely on Uni Precision for quality electronic engineering services. We operate with ISO standards and are IPC compliant.

Expert Electronic Engineering Capabilities

With more than 3 decades in operation, Uni Precision offers a specialization in vertical electronics manufacturing services (EMS). Many customers turn to us for quality surface-mount-technology (SMT) including quad flat no leads (QFN) printed circuit board assembly. We also offer through-hold assembly, ball-grid array soldering and an array of programming and serializing capabilities.

 

From PCB production to final box build, Uni Precision engineers can provide expert design services that meet your application requirements. Our engineers have worked with some of the most high-tech companies on a diverse variety of projects.

 

We have engineered and manufactured electronic products for industries including:

 

From customized electronic prototypes to turnkey manufacturing services, many large companies rely on Uni Precision for quality electronic engineering services. We operate with ISO standards and are IPC compliant.

One of China’s leading contract manufacturers, we provide engineering assistance on array of electronic considerations. With a corporate culture driven by excellence and some of the industry’s latest equipment and technology, our engineers can optimize the design and production of your electronic products. We help to lower costs, improve performance and ensure your parts exceed expectations.

 

Expert Electronic Design & Contract Manufacturing
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Our expert electronic engineering team often:

 

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​Process

Evaluates surface considerations including board thickness, pad size and surface finishes.

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​Process

Works to ensure SMD components are handled per the MSL classification, and SMT processes avoid thermal and mechanical damage

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​Process

Reviews assembly and design factors, such as the solder mask alignment, component density, pitch and orientation​.

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​Process

Works to ensure components meet all compliance requirements, including the latest J-STD-020 standards, with compliance at higher temperatures for Pb-free and lower temperature Sn-Pb assemblies.

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​Process

Designs the stencil thickness and hole size, use of solder paste material and reflow profile setup to ensure the solder joints meet IPC-610 standards.

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​Process

If needed, fine tune the SMT process based on AOI, X-ray inspection and testing data. 

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